Introducing the first cloud based auction platform to simplify corporate bond issuance.

For

Corporate
Debt Issuers

Simplify your bond issuances.

For

Institutional
Investors

Get the bonds you really want.

For

Banking
Partners

Deepen your client relationship.

The Cap Connectors.

As former corporate treasurers, investors and bankers ourselves, we joined together to simplify the debt issuance process via an auction platform to put you in control and change the status quo.

A simple platform.

Fair and transparent. True price discovery. Rules based allocations. Supported by partners you trust.

Patent pending (USPTO No. 63-115.001)

For Issuers

Lower your overall cost of debt.

For Investors

Get the bonds you really want.

TRANSPARENTLY

Connect. Communicate. Transact.

We created CapConnect+ to simplify and digitize the bond issuance and investment process – giving issuers and investors the gift of control, fairness, accuracy, transparency, and material cost savings.

Corporate
Debt Issuers

Institutional
Investors

Banking
Partners

Securities offered through CapConnect+ eMarkets, a member of FINRA & SIPC | Office Address – Redmond office center building 4, 7981-168th Avenue NE, suite 200, Redmond, WA 98052. Check the background of CapConnect+ eMarkets LLC on FINRA BrokerCheck. All information contained herein is for informational purposes only and any reliance on any portion of the information shall be at your own risk. The information is not to be construed as a recommendation, an offer to buy or sell, or the solicitation of an offer to buy or sell or enter into any transaction respecting any security or financial instrument.